Shares of ASE Technology (NYSE:ASX) are rising to test the highs set in April and in the summer of 2018. The stock was recently upgraded by analysts at Goldman Sachs and Macquarie. The company provides a variety of packaging and testing services out of its headquarters in Taiwan. Watch for a breakout to the highs set in early 2018 which would be worth a rise of more than 50% from here.
Source Investorplace
Average analysts price target $2.56
Average analysts recommendation Overweight
P/E ratio 19
Yield 2.26
Short interest
ASE Technology Holding Co., Ltd. engages in the provision of semiconductor manufacturing services in assembly and test. The firm develops and offers turnkey solutions for the front-end engineering test, wafer probing and final test, as well IC packaging, materials and electronic manufactures services. It operates through the following segments: Packaging, Testing, Electronic Manufacturing Services (EMS), Estate, and Others. The Packaging segment offers a broad range of package types such as flip-chip BGA, flip-chip chip scale packages, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier, quad flat no-lead packages, advanced quad flat no-lead packages, and plastic BGA. The Testing segment provides complete range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/RF/(2.5D/3D) module and SiP/ MEMS/Discrete and other test-related services. The EMS segment is comprised of the SMT assembly line which provides activities such as, solder paste stencil printing, component placement, and solder reflow. The company was founded in April 2018 and is headquartered in Kaoshiung, Taiwan.
Source Investorplace
Average analysts price target $2.56
Average analysts recommendation Overweight
P/E ratio 19
Yield 2.26
Short interest
ASE Technology Holding Co., Ltd. engages in the provision of semiconductor manufacturing services in assembly and test. The firm develops and offers turnkey solutions for the front-end engineering test, wafer probing and final test, as well IC packaging, materials and electronic manufactures services. It operates through the following segments: Packaging, Testing, Electronic Manufacturing Services (EMS), Estate, and Others. The Packaging segment offers a broad range of package types such as flip-chip BGA, flip-chip chip scale packages, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier, quad flat no-lead packages, advanced quad flat no-lead packages, and plastic BGA. The Testing segment provides complete range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/RF/(2.5D/3D) module and SiP/ MEMS/Discrete and other test-related services. The EMS segment is comprised of the SMT assembly line which provides activities such as, solder paste stencil printing, component placement, and solder reflow. The company was founded in April 2018 and is headquartered in Kaoshiung, Taiwan.