MI TECHNOVATION BERHAD MI

MI MYX
MI
MI TECHNOVATION BERHAD MYX
 
Upcoming Earnings
EPS
Market Cap
Div Yield
P/E
Upcoming Earnings
EPS
Market Cap
Div Yield
P/E

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Valuation
Enterprise Value/EBITDA, TTM
Enterprise Value, FQ
Market Cap — Basic
Number of Employees
Number of Shareholders
Price/Earnings, TTM
Price/Revenue, TTM
Price/Book Ratio, FY
Price/Sales Ratio, FY
Balance Sheet
Current Ratio, FQ
Debt to Equity, FQ
Net Debt, FQ
Quick Ratio, FQ
Total Assets, FQ
Total Debt, FQ
Operating Metrics
Return on Assets, TTM
Return on Equity, TTM
Return on Invested Capital, TTM
Revenue per Employee, TTM
Price History
Average Volume (10 day)
Beta - 1 Year
Price - 52 Week High
Price - 52 Week Low
Dividends
Dividends Paid, FY
Dividends per Share, FY
Expected Annual Dividends
Dividends Yield
Margins
Net Margin, TTM
Gross Margin, TTM
Operating Margin, TTM
Pretax Margin, TTM
Income Statement
Basic EPS, Net Income
Earnings per Share, Basic, TTM
EBITDA, TTM
Gross Profit, FY
Last Annual EPS
Last Annual Revenue, FY
Net Income, FY
Total Revenue, FY
Free Cash Flow, TTM

Profile

Sector: Producer Manufacturing
Industry: Industrial Machinery
Mi Technovation Bhd. engages in the design, development, manufacture, and sale of wafer level chip scale packaging sorting machines. It operates through the following business units namely the Semiconductor Equipment Business Unit (SEBU) and Semiconductor Material Business Unit (SMBU). SEBU run under Mi Equipment trademark with global footprint across Taiwan, China, Korea and USA. It is involved in the manufacturing and sales of the semiconductor manufacturing equipment, paired with smart factory automation solutions for Industrial 4.0, with product portfolio comprises equipment for advanced packaging die sorting and taping, vision inspection on wafer and package, precision bonding as well as final test process. The SMBU is run under Accurus Scientific trademark with physical presence in Tainan (Taiwan) being the headquarter, Ningbo (China) and Singapore. It is mainly involved in the manufacturing and sale of solder spheres (also known as solder balls), a key assembly and packaging material in the semiconductor industry. The company was founded on June 19, 2017 and is headquartered in Bayan Lepas, Malaysia.