HP Inc. 4.75% 15-JAN-2028HP Inc. 4.75% 15-JAN-2028HP Inc. 4.75% 15-JAN-2028

HP Inc. 4.75% 15-JAN-2028

In-depth bond breakdown



Key facts


Issuer
Issue date
Jun 21, 2022
Maturity date
Jan 15, 2028
Outstanding amount
‪900.00 M‬USD
Face value
1,000.00USD
Minimum denomination
2,000.00USD
Coupon
4.75% (Fixed)
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