T-Mobile USA, Inc. 4.95% 15-MAR-2028T-Mobile USA, Inc. 4.95% 15-MAR-2028T-Mobile USA, Inc. 4.95% 15-MAR-2028

T-Mobile USA, Inc. 4.95% 15-MAR-2028

In-depth bond breakdown



Key facts


Issue date
Feb 9, 2023
Maturity date
Mar 15, 2028
Outstanding amount
‪1.00 B‬USD
Face value
1,000.00USD
Minimum denomination
2,000.00USD
Coupon
4.95% (Fixed)
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