UUU

Helios Software Holdings, Inc. 4.625% 01-MAY-2028

No trades
See on Supercharts

Key terms


Outstanding amount
‪350.00 M‬USD
Face value
1,000.00USD
Minimum denomination
200,000.00USD
Coupon
4.63% (Fixed)
Coupon frequency
Semi-annual
Yield to maturity
Maturity date
May 1, 2028
Term to maturity
2 years

About Helios Software Holdings, Inc. 4.625% 01-MAY-2028


Issuer
Helios Software Holdings, Inc.
Sector
Technology Services
Industry
Packaged Software
Issue date
Apr 30, 2021
ISIN
USU4233HAA87
FIGI
BBG0109YF944
Helios Software Holdings, Inc. develops software. The company is headquartered in Delaware, DE.

See how Helios Software Holdings, Inc. is moving with its highest-yielding bonds.
Advanced bond data for paid plans
Unlock important bond data including coupon rates, redemption details, risk assessments, and much more.