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Helios Software Holdings, Inc. 4.625% 01-MAY-2028

In-depth bond breakdown



Key facts


Issuer
Helios Software Holdings, Inc.
Issue date
Apr 30, 2021
Maturity date
May 1, 2028
Outstanding amount
‪3.55 M‬USD
Face value
1,000.00USD
Minimum denomination
200,000.00USD
Coupon
4.63% (Fixed)
Helios Software Holdings, Inc. develops software. The company is headquartered in Delaware, DE.
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