The Company provides semiconductor assembly and test (OSAT) service for the semiconductor industry covering radio frequency, fiber-optics transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies. Its activities include wafer processing, chip fabrication and wafer certification in fiber optic chips, system in package assembly and test, and other services. Its wafer processing includes probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. Its system in package assembly and test includes surface mount technology, high speed and high accuracy flip-chip dice placement, in-line post vision, molding underfill (MUF) and post-mold oxide plating, and final testing. Its other services include sensor and IC package design and characterization.
Current Support : EM2.59 but I think will visit Fib 0.618 , monitor for LL/LH first. TYOR
Collection Area at RM2.87-3.1
1st Resistance: RM3.43
Current Support : EM2.59 but I think will visit Fib 0.618 , monitor for LL/LH first. TYOR
Collection Area at RM2.87-3.1
1st Resistance: RM3.43